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Disclaimer

LMSEMI discloses information about the constituent substances of its products to provide customers with accurate products that comply with RoHS and REACH regulations as much as possible, so as to meet customer needs and legal requirements. However, the data is compiled based on information provided by raw material suppliers, and some information may not be available due to raw material suppliers' information confidentiality policies, so absolute accuracy cannot be guaranteed. The product constituent substance information is an estimated result of the average weight and composition content of the product based on the above calculation formula. Moreover, it does not include impurities diffused into silicon devices and metal raw materials.


As product design and regulatory requirements are constantly updated, the content of this statement is for reference only. LMSEMI shall not be liable for any inaccuracies or incompleteness of the information. If you have any questions about the environmental compliance substance management of LMSEMI products, please contact the customer service window at Lmsemi@163.com for details.

Halogen-Free Product Description

In view of the fact that electronic waste and plastic products containing halogen compounds are prone to produce dioxins (the "toxic of the century") after combustion, which have bioaccumulation and cause health hazards, the electronics industry is expanding product halogen-free requirements to semiconductor devices based on the standard IEC 61249-2-21:2003 "Printed Circuit Boards and Other Interconnecting Structure Materials - Part 2-21".


As part of its active participation in environmental protection activities, LMSEMI is committed to the halogen-free production of semiconductor products and now has the capability to provide halogen-free products for all packaging/series.

* Except for some customized products with special customer requirements.

Lead-Free Product Description

All product series of LMSEMI use lead-free plating for their pins.

Product Exemption Description

Product CategoryPackaging TypeExempted ComponentExemption Clause No.Original Text of Exemption Clause
Molded Diodes, Transistors, Bridge RectifiersThrough-Hole/SMDGPP Chip7(c)-I Lead in glass or ceramic materials (excluding ceramic dielectrics in capacitors) in electrical and electronic components, such as piezoelectric devices or glass/ceramic composite components
Molded Diodes, Transistors, Bridge RectifiersThrough-Hole/SMDInternal High-Melting-Point Solder Flakes7(a)Lead in high melting temperature type solders (i.e., lead-based alloy solders with lead content exceeding 85%)

RoHS Declaration

All product series of LMSEMI comply with the requirements of the EU RoHS Directive, and LMSEMI provides customers with data information on the compliance of its products with RoHS chemical substances.

* Except for some customized products with special customer requirements.

Restricted Substances and Maximum Content under EU RoHS Directive*1

Substances Restricted by EU RoHSMaximum Content (ppm)
Lead (Pb)1,000
Mercury (Hg)1,000
Cadmium (Cd)100
Hexavalent Chromium (Cr6+)1,000
Polybrominated Biphenyls (PBB)1,000
Polybrominated Diphenyl Ethers (PBDE)1,000
Dibutyl Phthalate (DBP)1,000
Benzyl Butyl Phthalate (BBP)1,000
Di(2-ethylhexyl) Phthalate (DEHP)1,000
Diisobutyl Phthalate (DIBP)1,000

*1. EU RoHS Directive: (The European Parliament and the Council of the European Union adopted the RoHS Directive in January 2003, i.e., the Directive on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment)

Calculation of Concentrations of 10 Hazardous Substances Regulated by RoHS Directive

The test value of homogeneous materials reflects the average concentration of hazardous substances regulated by the RoHS Directive in the homogeneous material.

The test value of finished products reflects the average concentration of hazardous substances regulated by RoHS in the product.

Calculation formula: Concentration (ppm) = Mass of hazardous substance (mg) / Total mass of corresponding material (mg) * 1,000,000

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Definition of Product Components (Taking SMD Products as an Example)

Molding Compound: Resin used to protect components.

Lead Frame: Serves as the base for fixing the chip and functions as an electrode.

Die Attach: Material used to bond the chip and the lead frame.

Die: The main functional part for electrical performance.

Wire Bond: Metal wire connecting the chip electrode and the lead frame electrode.

Plating Layer: Electroplated metal on the surface of the pins on the lead frame.

Marking: Characters on the product body, including laser marking and ink marking.

Product Exemption Description

Product CategoryPackaging TypeExempted ComponentExemption Clause No. Original Text of Exemption Clause
Molded Diodes, Transistors, Bridge RectifiersThrough-Hole/SMDGPP Chip7(c)-I  Lead in glass or ceramic materials (excluding ceramic dielectrics in capacitors) in electrical and electronic components, such as piezoelectric devices or glass/ceramic composite components 
Molded Diodes, Transistors, Bridge RectifiersThrough-Hole/SMDInternal High-Melting-Point Solder Flakes7(a) Lead in high melting temperature type solders (i.e., lead-based alloy solders with lead content exceeding 85%) 

Environmental Load Substance Management Policy Statement

The coordination of environmental protection and economic development, the establishment of a global green supply chain, and the realization of sustainable human development have become the environmental consensus of the international community today. For environmental protection purposes, many countries and regions around the world have formulated environmental protection standards, laws and regulations, requiring the business community, which plays a crucial role in environmental protection and economic growth, to take corresponding responsibilities.


The RoHS Directive was issued in July 2006; China's RoHS Directive "Administrative Measures for the Control of Pollution from Electronic Information Products" was issued in March 2007; the REACH Regulation "Registration, Evaluation, Authorization and Restriction of Chemicals" was issued in June 2007, indicating that the regulation of environmental load substances is increasingly strengthened.


LMSEMI pays attention to global environmental protection, actively responds to and promotes "clean production", and relies on the QC080000 Hazardous Substance Process Management System to implement comprehensive and effective environmental load substance management methods and technologies, ensuring that product design, material composition, manufacturing and sales comply with international and domestic legal requirements and customer requirements.


All product series of LMSEMI comply with the requirements of the EU RoHS and REACH regulations, and the pin parts of the products all use lead-free plating. LMSEMI is committed to the halogen-free production of semiconductor products and now has the capability to provide halogen-free products for all packaging/series. * Except for some customized products with special customer requirements.

Hazardous Substance Reduction Policy

Improve process flow and comply with environmental protection laws and regulations for electronic products

Actively implement the reduction of hazardous substances

Commit to the realization of green and environmentally friendly products

Jointly build a harmonious and beautiful future

Environmental Protection Policy

Protect the natural environment and utilize resources rationally: Improve process flow, commit to pollution prevention and waste recycling, strive to achieve emission reduction, strengthen emergency preparedness measures, prevent environmental accidents, and minimize the company's impact on the environment.

Comply with environmental protection laws and regulations and prevent environmental pollution: Actively carry out environmental protection publicity and education, improve environmental awareness of all employees, and promote the participation of all employees in the continuous improvement of the company's environmental performance.

Carry out environmental education and promote environmental protection concepts: Promote environmental protection concepts and improve the environmental awareness of employees and relevant parties.

Continuously improve the environment and enhance environmental quality: Properly manage waste.